Electronics Forum | Tue Nov 27 13:36:22 EST 2001 | jmathis
Solder balls on the topside of our wave solder boards is a real issue. We have found that during the wave solder process, solder will enter through the via holes in the form of solder balls. It seems to be related to flux captured in the vias and o
Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge
I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve
Matrix Maintenance in PXI with BIRST Werner Engelmaier: "Mr Reliability" passes. Matrix Maintenance in PXI with BIRST Switching systems, and in particular matrices are a key part of many tests systems. They allow a single core set of test
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
: The test method designed to determine the removal effect the flux has, if any, on the bright copper mirror film, which has been vacuum deposited on clear glass. D Dendrites (dendritic growths
Imagineering, Inc. | https://www.pcbnet.com/blog/5-signs-your-pcb-may-need-to-be-repaired-or-replaced/
: Electrical connectivity issues (including open and short circuits). Cold joints lead to weak bonds and intermittent connections. Solder splatter and flux residue
